Journal of electronic packaging

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Bibliographic Details
Corporate Author:	American Society of Mechanical Engineers
Format:	Electronic Journal
Language:	English
Published:	New York, N.Y. : American Society of Mechanical Engineers, ©1989-
Series:	Transactions of the ASME (1959)
Subjects:	Electronic packaging > Periodicals. Mise sous boîtier (Électronique) > Périodiques. Electronic packaging. Elektronisches Bauelement Verkapseln Zeitschrift Elektronisches Bauelement. Verkapseln. Zeitschrift. Periodical periodicals. Periodicals. Périodiques.
Online Access:	Enlace del recurso

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