Journal of microelectronics and electronic packaging

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Bibliographic Details
Previous Title:	International journal of microcircuits and electronic packaging
Corporate Author:	International Microelectronics and Packaging Society
Format:	Electronic Journal
Language:	English
Published:	Washington, DC : International Microelectronics and Packaging Society, 2004-
Subjects:	Microelectronics > Periodicals. Electronic packaging > Periodicals. Microelectronic packaging > Periodicals. Electronic packaging. Microelectronic packaging. Microelectronics. Periodicals.
Online Access:	Enlace del recurso

Description
Published:	Vol. 1, no. 1 (1st quarter 2004)-
Item Description:	"A publication of the International Microelectronics and Packaging Society."
Publication Frequency:	Quarterly
ISSN:	1555-8037 1551-4897 1063-1674

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