Advancing microelectronics

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Dettagli Bibliografici
Titolo precedente:	Inside ISHM
Enti autori:	International Microelectronics Assembly and Packaging Society, International Microelectronics and Packaging Society
Natura:	Elettronico Periodico
Lingua:	English
Pubblicazione:	Reston, VA : International Microelectronics and Packaging Society Research Triangle Park, NC : International Microelectronics Assembly and Packaging S
Soggetti:	Microelectronics > Periodicals. Multichip modules (Microelectronics) > Periodicals. Microelectronics industry > Periodicals. Electronic packaging > Periodicals. Electronic packaging. Microelectronics. Microelectronics industry. Multichip modules (Microelectronics) Periodicals.
Accesso online:	Enlace del recurso

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