_version_ 1849706551147757570
author_corporate International Microelectronics Assembly and Packaging Society
International Microelectronics and Packaging Society
author_corporate_role

author_facet International Microelectronics Assembly and Packaging Society
International Microelectronics and Packaging Society
building Library A
callnumber-first T - Technology
callnumber-label TK7874
callnumber-raw TK7874 .A38
callnumber-search TK7874 .A38
callnumber-sort TK 47874 A38
callnumber-subject TK - Electrical and Nuclear Engineering
collection Ebsco Engineering Source
ctrlnum (EBZ)ebs56835586e
dateSpan Began in 1994.
format Electronic
Journal
fullrecord {"leader":"02118cas a22004572i 4500","fields":[{"001":"ebs56835586e"},{"003":"EBZ"},{"006":"m d ||||||"},{"007":"cr|unu||||||||"},{"008":"970926c19949999vaubr p o 0 a0eng c"},{"022":{"subfields":[{"y":"2380-7008"}],"ind1":" ","ind2":" "}},{"035":{"subfields":[{"a":"(EBZ)ebs56835586e"}],"ind1":" ","ind2":" "}},{"040":{"subfields":[{"a":"VPI "},{"b":"eng "},{"d":"EBZ"}],"ind1":" ","ind2":" "}},{"042":{"subfields":[{"a":"pcc nsdp"}],"ind1":" ","ind2":" "}},{"050":{"subfields":[{"a":"TK7874"},{"b":".A38"}],"ind1":"0","ind2":"0"}},{"050":{"subfields":[{"a":"TK7874"},{"b":".A38"}],"ind1":" ","ind2":"4"}},{"130":{"subfields":[{"a":"Advancing microelectronics (Online)"}],"ind1":"0","ind2":" "}},{"222":{"subfields":[{"a":"Advancing microelectronics"}],"ind1":"1","ind2":"0"}},{"245":{"subfields":[{"a":"Advancing microelectronics"},{"h":"[electronic resource] /"},{"c":"published by IMAPS--International Microelectronics and Packaging Society and Educational Foundation."}],"ind1":"0","ind2":"0"}},{"246":{"subfields":[{"a":"Advancing Microelectronics Magazine"}],"ind1":"2","ind2":" "}},{"264":{"subfields":[{"a":"Reston, VA :"},{"b":"International Microelectronics and Packaging Society"}],"ind1":" ","ind2":"1"}},{"264":{"subfields":[{"3":"<2015-> :"},{"a":"Research Triangle Park, NC :"},{"b":"International Microelectronics Assembly and Packaging S"}],"ind1":"3","ind2":"1"}},{"310":{"subfields":[{"a":"Bimonthly"}],"ind1":" ","ind2":" "}},{"362":{"subfields":[{"a":"Began in 1994."}],"ind1":"1","ind2":" "}},{"650":{"subfields":[{"a":"Microelectronics"},{"v":"Periodicals."}],"ind1":" ","ind2":"0"}},{"650":{"subfields":[{"a":"Multichip modules (Microelectronics)"},{"v":"Periodicals."}],"ind1":" ","ind2":"0"}},{"650":{"subfields":[{"a":"Microelectronics industry"},{"v":"Periodicals."}],"ind1":" ","ind2":"0"}},{"650":{"subfields":[{"a":"Electronic packaging"},{"v":"Periodicals."}],"ind1":" ","ind2":"0"}},{"650":{"subfields":[{"a":"Electronic packaging."},{"2":"fast"},{"0":"(OCoLC)fst00907414"}],"ind1":" ","ind2":"7"}},{"650":{"subfields":[{"a":"Microelectronics."},{"2":"fast"},{"0":"(OCoLC)fst01019757"}],"ind1":" ","ind2":"7"}},{"650":{"subfields":[{"a":"Microelectronics industry."},{"2":"fast"},{"0":"(OCoLC)fst01019790"}],"ind1":" ","ind2":"7"}},{"650":{"subfields":[{"a":"Multichip modules (Microelectronics)"},{"2":"fast"},{"0":"(OCoLC)fst01028806"}],"ind1":" ","ind2":"7"}},{"655":{"subfields":[{"a":"Periodicals."},{"2":"fast"},{"0":"(OCoLC)fst01411641"}],"ind1":" ","ind2":"7"}},{"710":{"subfields":[{"a":"International Microelectronics Assembly and Packaging Society."}],"ind1":"2","ind2":" "}},{"710":{"subfields":[{"a":"International Microelectronics and Packaging Society."}],"ind1":"2","ind2":" "}},{"773":{"subfields":[{"t":"Engineering Source "},{"d":"EBSCO"}],"ind1":"0","ind2":" "}},{"776":{"subfields":[{"i":"Online version:"},{"t":"Advancing microelectronics"},{"x":"2380-7016"},{"w":"(DLC) 2015203272"},{"w":"(OCoLC)919726442"}],"ind1":"0","ind2":"8"}},{"776":{"subfields":[{"t":"Advancing microelectronics /"},{"x":"2380-7008"},{"w":"(OCoLC)37691056"},{"w":"(DLC)2013254504"}],"ind1":"1","ind2":" "}},{"780":{"subfields":[{"t":"Inside ISHM"},{"w":"(OCoLC)48463449"}],"ind1":"0","ind2":"0"}},{"856":{"subfields":[{"3":"Full text available: Mar 2010-."},{"u":"https://uwiener.metaproxy.org/UWIENER?url=https://search.ebscohost.com/direct.asp?db=egs&jid=8S7V&scope=site"},{"z":"Enlace del recurso"}],"ind1":"4","ind2":"0"}},{"901":{"subfields":[{"a":"Trade Publication"}],"ind1":" ","ind2":" "}}]}
genre Periodicals. fast (OCoLC)fst01411641
genre_facet Periodicals.
id ebs56835586e
illustrated Illustrated
institution EBSCO
issn 2380-7016
2380-7008
language English
publisher International Microelectronics and Packaging Society
International Microelectronics Assembly and Packaging S
record_format marc
spelling Advancing microelectronics (Online)
Advancing microelectronics
Advancing microelectronics [electronic resource] / published by IMAPS--International Microelectronics and Packaging Society and Educational Foundation.
Advancing Microelectronics Magazine
Reston, VA : International Microelectronics and Packaging Society
<2015-> : Research Triangle Park, NC : International Microelectronics Assembly and Packaging S
Bimonthly
Began in 1994.
Microelectronics Periodicals.
Multichip modules (Microelectronics) Periodicals.
Microelectronics industry Periodicals.
Electronic packaging Periodicals.
Electronic packaging. fast (OCoLC)fst00907414
Microelectronics. fast (OCoLC)fst01019757
Microelectronics industry. fast (OCoLC)fst01019790
Multichip modules (Microelectronics) fast (OCoLC)fst01028806
Periodicals. fast (OCoLC)fst01411641
International Microelectronics Assembly and Packaging Society.
International Microelectronics and Packaging Society.
Engineering Source EBSCO
Online version: Advancing microelectronics 2380-7016 (DLC) 2015203272 (OCoLC)919726442
Advancing microelectronics / 2380-7008 (OCoLC)37691056 (DLC)2013254504
Inside ISHM (OCoLC)48463449
Full text available: Mar 2010-. https://uwiener.metaproxy.org/UWIENER?url=https://search.ebscohost.com/direct.asp?db=egs&jid=8S7V&scope=site Enlace del recurso
spellingShingle Advancing microelectronics
Microelectronics Periodicals.
Multichip modules (Microelectronics) Periodicals.
Microelectronics industry Periodicals.
Electronic packaging Periodicals.
Electronic packaging. fast (OCoLC)fst00907414
Microelectronics. fast (OCoLC)fst01019757
Microelectronics industry. fast (OCoLC)fst01019790
Multichip modules (Microelectronics) fast (OCoLC)fst01028806
thumbnail /EBSCO/ebsco_engineeringsource/logo.png
title Advancing microelectronics
title_alt Advancing microelectronics (Online)
Advancing Microelectronics Magazine
title_auth Advancing microelectronics
title_full Advancing microelectronics [electronic resource] / published by IMAPS--International Microelectronics and Packaging Society and Educational Foundation.
title_fullStr Advancing microelectronics [electronic resource] / published by IMAPS--International Microelectronics and Packaging Society and Educational Foundation.
title_full_unstemmed Advancing microelectronics [electronic resource] / published by IMAPS--International Microelectronics and Packaging Society and Educational Foundation.
title_old Inside ISHM
title_short Advancing microelectronics
title_sort advancing microelectronics
topic Microelectronics Periodicals.
Multichip modules (Microelectronics) Periodicals.
Microelectronics industry Periodicals.
Electronic packaging Periodicals.
Electronic packaging. fast (OCoLC)fst00907414
Microelectronics. fast (OCoLC)fst01019757
Microelectronics industry. fast (OCoLC)fst01019790
Multichip modules (Microelectronics) fast (OCoLC)fst01028806
topic_facet Microelectronics
Multichip modules (Microelectronics)
Microelectronics industry
Electronic packaging
Electronic packaging.
Microelectronics.
Microelectronics industry.
url https://uwiener.metaproxy.org/UWIENER?url=https://search.ebscohost.com/direct.asp?db=egs&jid=8S7V&scope=site
work_keys_str_mv UT advancingmicroelectronicsonline
AT internationalmicroelectronicsassemblyandpackagingsociety advancingmicroelectronics
AT internationalmicroelectronicsandpackagingsociety advancingmicroelectronics
AT internationalmicroelectronicsassemblyandpackagingsociety advancingmicroelectronicsmagazine
AT internationalmicroelectronicsandpackagingsociety advancingmicroelectronicsmagazine