Advancing microelectronics

Advancing microelectronics

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Bibliographic Details
Previous Title:Inside ISHM
Corporate Authors: International Microelectronics Assembly and Packaging Society, International Microelectronics and Packaging Society
Format: Electronic Journal
Language:English
Published: Reston, VA : International Microelectronics and Packaging Society
Research Triangle Park, NC : International Microelectronics Assembly and Packaging S
Subjects:
Microelectronics > Periodicals.
Multichip modules (Microelectronics) > Periodicals.
Microelectronics industry > Periodicals.
Electronic packaging > Periodicals.
Electronic packaging.
Microelectronics.
Microelectronics industry.
Multichip modules (Microelectronics)
Periodicals.
Online Access:Enlace del recurso
Description
Published:Began in 1994.
Publication Frequency:Bimonthly
ISSN:2380-7016
2380-7008

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